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Heat-Proof Antistatic JEDEC Matrix Trays For IC Components With Injection Molding

Heat-Proof Antistatic JEDEC Matrix Trays For IC Components With Injection Molding

ブランド名: Hiner-pack
モデル番号: HN24117
MOQ: 500pcs
価格: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
支払条件: 100% Prepayment
供給能力: 2000PCS/Day
詳細情報
起源の場所:
深Shenzhen China
証明:
RoHS、ISO
カスタマイズされたサービス:
サポート標準と非標準
マトリックス:
4*7=28 個
耐久性のある:
はい
材料:
MPPO
スタック可能:
はい
表面抵抗:
1.0x10E4~1.0x10E11Ω
成形方法:
射出成形
Packaging Details:
70~100pcs/carton(According To The Customer Demand)
Supply Ability:
2000PCS/Day
ハイライト:

Surface Resistance 1.0x10E4~1.0x10E11Ω JEDEC Matrix Trays

,

Matrix 8*18=144PCS JEDEC Trays

,

Durable IC Component Trays

製品説明
Heat-Proof Antistatic JEDEC Matrix Trays For IC Components With Injection Molding
JEDEC (Joint Electronic Device Engineering Council - www.jedec.org) creates open standards for the microelectronics industry, ensuring product interoperability, benefiting the industry and ultimately consumers by reducing product development time and costs while increasing efficiency and productivity.
JEDEC trays all are the same size, with a standardized outline, and required features. Putting parts in a JEDEC tray ensures that your parts can be processed in industry-standard automation equipment like pick and place machines, inspection, laser marking, testing, and dispensing equipment. Commercially available JEDEC tray feeders can be easily added to custom process machines. When you use JEDEC trays, you get an instant benefit from decades of experience and access to an installed base and continuing supply of automation tools.
The maximum baking temperature is stamped into JEDEC trays. Exceeding the stated maximum baking temperature will cause the dimensions of the tray to alter; thus, potentially damaging the contents. The type of molding compound used during the tray's manufacture determines the tray's maximum temperature rating. Multiple compounds and/or powders are mixed together during the molding process to add specific features such as color, ESD properties, dimensional stability and maximum temperature ratings.
Features:
  • In general, JEDEC trays are custom designed and manufactured. Many of them are not only device specific but device manufacturer specific.
  • It's not uncommon for two component sources' parts to require different trays because of allowable variation in package sizing.
  • Off-the-shelf simply means a manufacturer has enough demand for a specific custom tray that they carry some inventory.
  • More common is open-tooled where a custom mold will be set up and run for any order but often with a minimum quantity and/or significant setup charges.
Technical Parameters:
Brand Hiner-pack Outline Line Size 322.6x135.9x7.62mm
Model HN24117 Cavity Size 10*6.45*2.6mm
Material MPPO Matrix QTY 4*7=28PCS
Package Type IC Component Flatness MAX 0.76mm
Color Black Service Accept OEM, ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate RoHS, IOS
Applications:
  • Packaging: At their core, trays are simply containers. The JEDEC tray outline includes features for stacking, whereby each successive tray becomes the cover for the tray below.
  • Transportation & Storage: Parts loaded into stacked JEDEC trays are easy to store or transport, across the room or around the world. JEDEC trays also function as process "boats", transporting their contents through a variety of process tools and equipment.
  • Protection: JEDEC trays protect the parts they hold from mechanical damage. Most JEDEC trays are manufactured using materials that also provide electrical protection from electrostatic discharge (ESD) damage.