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Durable Waffle Pack IC Trays for Contamination Control & Safe Chip Handling

Durable Waffle Pack IC Trays for Contamination Control & Safe Chip Handling

ブランド名: Hiner-pack
モデル番号: HN24146
MOQ: 500個
価格: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
支払条件: T/T
供給能力: 2000個/日
詳細情報
起源の場所:
中国
証明:
ROHS, ISO
皿の重量:
さまざまですが、通常はキャビティあたり最大 500 グラム
色:
品質保証:
配達保証,信頼性の高い品質
輪郭線のサイズ:
50.8×50.8×4.36mm
穴の大きさ:
1.08×1.08×2.18mm
インコタームズ:
exw、fob、cif、ddu、ddp
金型タイプ:
注射
再利用可能:
はい
トレーの形:
長方形
はっきりしたクラス:
概要および超音波清浄
ICタイプ:
BGA,QFP,QFN,LGA,PGA
梱包レベル:
輸送パッケージ
反り:
反りMAX 0.26mm
容量:
15x15=215 個
パッケージの詳細:
カートン、パレット
供給の能力:
2000個/日
製品説明
Durable Waffle Pack IC Trays for Contamination Control & Safe Chip Handling

High-Precision Cleanroom Waffle Pack IC Trays adopt dense precise grid cavity structure, meeting strict cleanroom industry standards.


With excellent contamination control & dust-proof performance, the trays provide stable safe handling, storage and transportation protection for delicate ESD-sensitive fine pitch semiconductor IC chips.


They are perfectly suitable for semiconductor manufacturing, packaging, inspection & testing processes, and support fully customized cavity size & layout designs to match various chip specifications.

Key Features/ Benefits 
  • Anti-static & dust-proof design for safe chip handling
  • High-precision compact grid cavity structure
  • Suitable for Delicate Fine Pitch ICs
  • More than 12 years of export experience.
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24146
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×4.36 mm
Cavity Size 1.08x1.08x2.18 mm
Matrix QTY 15x15=215 PCS
Warpage MAX 0.25mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Cleanroom-grade Waffle Pack IC Trays provide full protection for semiconductor chips with contamination control & ESD anti-static performance.
  • Fine pitch IC packaging (QFN, BGA, CSP bare die)
  • JEDEC compatible automated pick-and-place lines
  • Semiconductor inspection & testing processes
  • Cleanroom IC logistics transportation & storage management
Packaging & Shipping/ Services
Our high-precision JEDEC trays are packaged in durable, ESD-safe anti-static materials with secure interlocking stacking design and shock-absorbing cushioning inserts, ensuring maximum protection against physical damage, electrostatic discharge, and contamination during transit and storage.

All shipments are fully tracked and handled by trusted global logistics carriers, ensuring reliable, on-time worldwide delivery to your facility. We provide flexible shipping options to meet your urgent production needs, including expedited shipping for rush orders, and comprehensive shipping documentation to streamline customs clearance for international orders.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers