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Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips

Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips

ブランド名: Hiner-pack
モデル番号: HN24174
MOQ: 500個
価格: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
支払条件: T/T
供給能力: 2000個/日
詳細情報
起源の場所:
中国
証明:
ROHS, ISO
皿の重量:
さまざまですが、通常はキャビティあたり最大 500 グラム
色:
品質保証:
配達保証,信頼性の高い品質
輪郭線のサイズ:
50.8×50.8×3.94mm
穴の大きさ:
6.49x3.86x0.67mm
インコタームズ:
exw、fob、cif、ddu、ddp
金型タイプ:
注射
再利用可能:
はい
トレーの形:
長方形
はっきりしたクラス:
概要および超音波清浄
ICタイプ:
BGA,QFP,QFN,LGA,PGA
梱包レベル:
輸送パッケージ
反り:
反りMAX 0.2mm
容量:
5x7=35 個
パッケージの詳細:
カートン、パレット
供給の能力:
2000個/日
製品説明
Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips

Deliver stable anti-static protection for IC chips. Withstand up to 125℃ high temperature. Adopt optimized cross-slot structure to lock components tightly. Keep chips safe from dust and contamination. Need reliable semiconductor chip carrying solutions?


Fit semiconductor encapsulation, chip testing, die sorting and wafer processing. Adapt to automated production lines and precision handling workflows. Work smoothly in cleanroom and workshop environments.


Support chip turnover, storage, logistics and vacuum packaging. Offer flexible cavity size, layout and material customization. Create exclusive cross-slot designs for various IC models to meet specific needs.

Key Features/ Benefits 
  • Deliver effective ESD anti-static performance
  • Stable high-temperature resistance up to 125℃
  • Suitable for Delicate Fine Pitch ICs
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24174
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×3.94 mm
Cavity Size 6.49x3.86x0.67 mm
Matrix QTY 5x7=35 PCS
Warpage MAX 0.2mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Apply to semiconductor encapsulation, IC performance testing, die sorting and wafer fabrication. Adapt to high-precision electronic manufacturing and cleanroom operations.


Support chip internal turnover, long-term storage, logistics and vacuum packaging. Meet diversified integrated circuit processing and electronic assembly needs.

Customized Services
Accept personalized cross-slot customization. Offer flexible cavity size, layout and material upgrades. Create exclusive designs for diverse IC specifications. Provide one-stop tailored solutions for semiconductor packaging needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers