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Durable Grid Waffle Trays for Safe Fine Pitch IC Handling

Durable Grid Waffle Trays for Safe Fine Pitch IC Handling

ブランド名: Hiner-pack
モデル番号: HN24200
MOQ: 500個
価格: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
支払条件: T/T
供給能力: 2000個/日
詳細情報
起源の場所:
中国
証明:
ROHS, ISO
皿の重量:
さまざまですが、通常はキャビティあたり最大 500 グラム
色:
品質保証:
配達保証,信頼性の高い品質
輪郭線のサイズ:
50.8×50.8×3.94mm
穴の大きさ:
6.7X4.0X1.07mm
インコタームズ:
exw、fob、cif、ddu、ddp
モールドタイプ:
注射
再利用可能:
はい
トレーの形:
長方形
はっきりしたクラス:
概要および超音波清浄
ICタイプ:
BGA,QFP,QFN,LGA,PGA
梱包レベル:
輸送パッケージ
反り:
反りMAX 0.26mm
容量:
5x7=35 個
パッケージの詳細:
カートン、パレット
供給の能力:
2000個/日
製品説明
Durable Grid Waffle Trays for Safe Fine Pitch IC Handling
Feature uniform grid design to hold fine pitch ICs steadily without shifting. Fit various industrial processes and protect sensitive components from damage during daily operation.

Bring reliable performance for long-term use and reduce component loss in production and transfer. Match automatic equipment to improve working efficiency effectively.

Accept customized cavity size and layout to meet different chip requirements. Focus on practical protection to satisfy diverse production demands.
Key Features/ Benefits 
  • Secure component fixing
  • Offers stable cleanroom-grade contamination control
  • Stable component holding
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • Precise waffle structure.
Specifications
Brand Hiner-pack
Model HN24200
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×3.94 mm
Cavity Size 6.7X4.0X1.07 mm
Matrix QTY 5x7=35 PCS
Warpage MAX 0.26mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Suitable for fine pitch IC storage, production line transfer, component testing and packaging. Work stably in automatic industrial systems and daily manufacturing processes.

Applied in semiconductor factories, electronic assembly plants and chip packaging workshops. Ideal for industrial production, internal transportation and long-term component storage.
Packaging & Shipping/ Services
Packed in standard cartons with protective inner layers to avoid scratches and deformation. Support safe stacking for bulk transportation.

Available for sea, air and international express shipping. Ensure products arrive in good condition and ready for immediate industrial use.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers