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Stackable Impact Resistant Conductive Waffle Pack Chip Trays For Fragile Component Shipping

ブランド名:	Hiner-pack
モデル番号:	HN24130
MOQ:	500
価格:	TBC
支払条件:	100% Prepayment
供給能力:	2000PCS/Day

詳細情報

製品説明

詳細情報

起源の場所:

中国深セン

証明:

ISO 9001 ROHS SGS

反り:

最大0.2mm

インコタームズ:

exw、fob、cif、ddu、ddp

容量:

10x10=100個

材料:

パソコン

表面抵抗:

1.0x10E4~1.0x10E11Ω

寸法:

50.8×50.8×4mm

成形方法:

射出成形

Packaging Details:

500 Pcs/carton(According To Actual Packing）

Supply Ability:

2000PCS/Day

製品説明

Stackable Impact Resistant Conductive Waffle Pack Chip Trays For Fragile Component Shipping

The "waffle" design is not merely a naming convention; the internal matrix of separator ribs functions as a high-precision structural grid that significantly increases the tray's mechanical rigidity. When multiple trays are stacked, these ribs align to create a series of reinforced vertical pillars, distributing external crushing forces across the entire stack rather than onto the fragile components within. Constructed from permanently conductive ABS or PC resins, these trays provide a dual layer of protection: safeguarding against electrostatic discharge (ESD) while providing a robust physical shield. By utilizing advanced Moldflow analysis, we ensure that the tray wall thickness and rib height are optimized for maximum strength-to-weight ratio. This ensures that your bare die, chip-scale packages (CSPs), and high-value 2.5D components remain securely seated and entirely isolated from external mechanical stress, ensuring they arrive at their destination in factory-perfect condition.

Key Features/ Benefits

Multi-Ribbed Structural Reinforcement
Impact-Absorbent Conductive Polymers
Permanent, Non-Degrading ESD Shielding
Precision Stackable Interlock System
Cleanroom-Compatible Purity

Specifications

Brand		Hiner-pack
Model		HN24130
Material		ABS
Tray Type		2-inch Waffle Pack
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8x50.8x4mm
Cavity Size		1.75×1.2×0.35mm
Matrix QTY		10X10=100PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Certifications		RoHS, ISO

Applications

This series is the industry standard for Cross-Border Semiconductor Distribution and secure component transit. Its primary applications include: International Shipping of Bare Die, where the risk of mechanical damage is highest; Logistics for High-Value Optoelectronics, providing a stable and crush-proof environment for fragile lenses; and Inter-Facility Component Transfer, where trays are moved between different manufacturing and testing sites. The robust design also makes them suitable for Field Service and Repair Kits, where replacement micro-parts must be carried safely in uncontrolled environments. Because they utilize the unofficial industry-standard 2-inch footprint, they integrate seamlessly into all global microelectronic supply chains, compatible with existing covers, clips, and automated handling interfaces.

Customization

We provide specialized engineering services to optimize our trays for your specific logistics challenges. Customization options include Reinforced External Wall Thickness for even higher crush resistance and Tailored Pocket Depths to accommodate thicker components while maintaining stack stability. Our team can also design Custom Stacking Configurations and specialized covers for non-standard heights. We offer a variety of material grades, including specific conductive colors for easy shipment identification. With a library of existing designs, we can rapidly find a structural match for your components, or we can develop a completely new mold in as little as 3 to 4 weeks, ensuring your global shipping needs are met with a precision-engineered solution.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Factory-direct manufacturer of JEDEC & IC trays
JEDEC compliant, automation-compatible designs
OEM & ODM customization supported
Consistent quality and stable supply
Trusted by global semiconductor customers

タグ:

JEDEC ICの皿

JEDECのマトリックスの皿

ICの破片の皿

JEDECの注文の皿

ワッフルのパックの破片の皿

電子部品の皿

裸皿は死ぬ

反静的な皿

ワッフルのパックのふたクリップ

ゲルの粘着性がある箱

ウエファーの荷箱

メタル・ウェーファー・カセット

JEDEC ICの皿

JEDECのマトリックスの皿

ICの破片の皿

JEDECの注文の皿

ワッフルのパックの破片の皿

電子部品の皿

裸皿は死ぬ

反静的な皿

ワッフルのパックのふたクリップ

ゲルの粘着性がある箱

ウエファーの荷箱

メタル・ウェーファー・カセット

Stackable Impact Resistant Conductive Waffle Pack Chip Trays For Fragile Component Shipping

Stackable Impact Resistant Conductive Waffle Pack Chip Trays For Fragile Component Shipping

JEDEC ICの破片の皿

RF JEDECのマトリックスの皿

IC JEDECのマトリックスの皿

OEM再使用可能な反酸ESDのプラスチック皿の小型のライト級選手

OEMの黒の反静的な裸のダイスの皿2は非RoHSの有毒な標準をじりじり動かす

2 インチ方形ポータブルブラックプラスチック IC チップトレイ IC デバイスのための

ABS良質単一QFPワッフルのパックの皿5.5mmの厚さ

JEDEC ICの皿

JEDECのマトリックスの皿

ICの破片の皿

JEDECの注文の皿

ワッフルのパックの破片の皿

電子部品の皿

裸皿は死ぬ

反静的な皿

ワッフルのパックのふたクリップ

ゲルの粘着性がある箱

ウエファーの荷箱

メタル・ウェーファー・カセット

JEDEC ICの皿

JEDECのマトリックスの皿

ICの破片の皿

JEDECの注文の皿

ワッフルのパックの破片の皿

電子部品の皿

裸皿は死ぬ

反静的な皿

ワッフルのパックのふたクリップ

ゲルの粘着性がある箱

ウエファーの荷箱

メタル・ウェーファー・カセット

Stackable Impact Resistant Conductive Waffle Pack Chip Trays For Fragile Component Shipping

Stackable Impact Resistant Conductive Waffle Pack Chip Trays For Fragile Component Shipping

JEDEC ICの破片の皿

RF JEDECのマトリックスの皿

IC JEDECのマトリックスの皿

OEM再使用可能な反酸ESDのプラスチック皿の小型のライト級選手

OEMの黒の反静的な裸のダイスの皿2は非RoHSの有毒な標準をじりじり動かす

2 インチ 方形 ポータブル ブラック プラスチック IC チップ トレイ IC デバイスのための

ABS良質単一QFPワッフルのパックの皿5.5mmの厚さ

2 インチ方形ポータブルブラックプラスチック IC チップトレイ IC デバイスのための